Title:
PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE RESIN PRINTING PLATE PRECURSOR CONTAINING SAME
Document Type and Number:
WIPO Patent Application WO/2018/123773
Kind Code:
A1
Abstract:
Provided are the following: a photosensitive resin composition which can be developed using a solution containing a lower alcohol, exhibits excellent abrasion resistance and exhibits excellent ink wiping properties on a plate surface when squeegeed with a blade of a pad printing machine; and a photosensitive resin printing plate precursor. The photosensitive resin composition is characterized by containing: (A) inorganic fine particles having an average particle diameter of 0.5-4 μm and a sphericity of 0.9 or more; (B) a polyamide which has an aliphatic ring in the main molecular chain and/or having a skeleton represented by general formula (1); (C) a compound having an ethylenic double bond; and (D) a photopolymerization initiator.
Inventors:
ABURA TSUTOMU (JP)
TACHI NORIHITO (JP)
IDETA KOHEI (JP)
TAKAHASHI RYOSUKE (JP)
TACHI NORIHITO (JP)
IDETA KOHEI (JP)
TAKAHASHI RYOSUKE (JP)
Application Number:
PCT/JP2017/045753
Publication Date:
July 05, 2018
Filing Date:
December 20, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/004; C08G69/50; G03F7/00; G03F7/027; G03F7/037
Foreign References:
| JP2015022029A | 2015-02-02 | |||
| JP2005148107A | 2005-06-09 | |||
| JP2004043689A | 2004-02-12 | |||
| JPH0784370A | 1995-03-31 | |||
| JP2002333710A | 2002-11-22 | |||
| JP2016139130A | 2016-08-04 | |||
| JPH026957A | 1990-01-11 | |||
| JPS5818635A | 1983-02-03 | |||
| JPS58145613A | 1983-08-30 | |||
| JP2001199719A | 2001-07-24 | |||
| JP2016079061A | 2016-05-16 | |||
| JP2014122285A | 2014-07-03 | |||
| JP2017120049A | 2017-07-06 |
Other References:
See also references of EP 3561595A4
Attorney, Agent or Firm:
SEIRYU PATENT PROFESSIONAL CORPORATION et al. (JP)
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