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Title:
PHOTOSENSITIVE RESIN COMPOSITION FOR PRINTING SUBSTRATE CAPABLE OF LASER SCULPTURE
Document Type and Number:
WIPO Patent Application WO/2005/070691
Kind Code:
A1
Abstract:
A photosensitive resin composition for printing substrate capable of laser sculpture, comprising resin (a) having a polymerizable unsaturated group whose number average molecular weight is in the range of 1000 to 20×104, organic compound (b) having a polymerizable unsaturated group whose number average molecular weight is <1000 and organosilicon compound (c) having at least one Si-O bond in each molecule and having no polymerizable unsaturated group in molecules, wherein the content of organosilicon compound (c) is in the range of 0.1 to 10 wt.% based on the whole of photosensitive resin composition.

Inventors:
YAMADA HIROSHI (JP)
TOMEBA KEI (JP)
Application Number:
PCT/JP2005/000953
Publication Date:
August 04, 2005
Filing Date:
January 26, 2005
Export Citation:
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Assignee:
ASAHI KASEI CHEMICALS CORP (JP)
YAMADA HIROSHI (JP)
TOMEBA KEI (JP)
International Classes:
B41C1/05; B41C1/10; B41N1/12; G03F7/00; G03F7/004; G03F7/075; G03F7/027; G03F7/035; G03F7/038; (IPC1-7): B41N1/12; B41C1/05; G03F7/00; G03F7/004; G03F7/075
Foreign References:
JPH09146264A1997-06-06
JPH091916A1997-01-07
JPH03118193A1991-05-20
JP2003528342A2003-09-24
JP2001121833A2001-05-08
Other References:
THE CHEMICAL DAILY CO. LTD.: "no Kagaku Shohin", 25 January 1989, pages: 691 - 692, XP002992636
Attorney, Agent or Firm:
Asamura, Kiyoshi (New Ohtemachi Bldg. 2-1, Ohtemachi 2-chom, Chiyoda-ku Tokyo 04, JP)
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