Title:
PHOTOSENSITIVE RESIN COMPOSITION, PRODUCTION METHOD FOR CURED FILM USING SAME, CURED FILM, LIQUID CRYSTAL DISPLAY DEVICE, AND ORGANIC EL DISPLAY DEVICE
Document Type and Number:
WIPO Patent Application WO/2014/126088
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition capable of maintaining high sensitivity and of improving chemical resistance and cured film adhesiveness. The photosensitive resin composition contains: a polymer component including a polymer having a constituent unit (a1) having a group having an acid group protected by an acid-labile group and a constituent unit (a2) having a cross-linkable group (excluding block isocyanate groups and OH groups), or a polymer fulfilling at least one of either the polymer having constituent unit (a1) or the polymer having the constituent unit (a2); a photoacid generator; and a solvent. The polymer component includes at least one type of constituent unit (a4) having a block isocyanate group in at least a polymer having a constituent unit (a1) and a constituent unit (a2), a polymer having a constituent unit (a1), or a polymer having a constituent unit (a2); or the polymer component includes at least one type of polymer including a constituent unit (a4) and not including the constituent unit (a1) and the constituent unit (a2).
Inventors:
MATSUDA TOMOKI (JP)
KASHIWAGI DAISUKE (JP)
KASHIWAGI DAISUKE (JP)
Application Number:
PCT/JP2014/053153
Publication Date:
August 21, 2014
Filing Date:
February 12, 2014
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039
Domestic Patent References:
| WO2011096400A1 | 2011-08-11 |
Foreign References:
| JP2009288343A | 2009-12-10 | |||
| JP2012181488A | 2012-09-20 | |||
| JP2012208200A | 2012-10-25 |
Attorney, Agent or Firm:
SIKs & Co. (JP)
Patent business corporation patent firm Sykes (JP)
Patent business corporation patent firm Sykes (JP)
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