Title:
PHOTOSENSITIVE RESIN COMPOSITION, RESIST FILM, PATTERN FORMING METHOD AND METHOD FOR PRODUCING ELECTRONIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/064976
Kind Code:
A1
Abstract:
Provided are: a photosensitive resin composition from which a pattern that has an excellent shape is able to be obtained; a resist film which is a solidified product of this photosensitive resin composition; a pattern forming method which uses this resist film; and a method for producing an electronic device, which uses this resist film. This photosensitive resin composition contains a resin, a photoacid generator, a solvent and a low-molecular-weight ester compound; and the low-molecular-weight ester compound has alkali degradability, while having a molecular weight of less than 1,500. The content of the low-molecular-weight ester compound is from 0.1% by mass to 6% by mass (inclusive) relative to the total solid content of the composition.
Inventors:
TANGO NAOHIRO (JP)
GOTO AKIYOSHI (JP)
O KEIYU (JP)
MARUMO KAZUHIRO (JP)
NISHIO RYO (JP)
TAKADA AKIRA (JP)
GOTO AKIYOSHI (JP)
O KEIYU (JP)
MARUMO KAZUHIRO (JP)
NISHIO RYO (JP)
TAKADA AKIRA (JP)
Application Number:
PCT/JP2018/030295
Publication Date:
April 04, 2019
Filing Date:
August 14, 2018
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F20/00; G03F7/004; G03F7/038; G03F7/20
Foreign References:
| JP2016212403A | 2016-12-15 | |||
| JP2012137565A | 2012-07-19 | |||
| JP2012190008A | 2012-10-04 | |||
| JP2013068776A | 2013-04-18 | |||
| JP2007108451A | 2007-04-26 | |||
| JP2006048029A | 2006-02-16 | |||
| JP2017151474A | 2017-08-31 | |||
| JP2017161717A | 2017-09-14 |
Attorney, Agent or Firm:
NAKASHIMA Junko et al. (JP)
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