Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, CURED PRODUCT, CURED PRODUCT PRODUCTION METHOD, SEMICONDUCTOR DEVICE, DISPLAY DEVICE, AND RESIN PRODUCTION METHOD
Document Type and Number:
WIPO Patent Application WO/2024/070845
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a highly sensitive photosensitive resin composition with which the amount of film reduction during alkaline development is reduced and exposure time can be shortened. The present invention is a photosensitive resin composition comprising (A) one or more kinds of resin including a certain constituent unit, the resin being selected from the group consisting of polyimide, polybenzoxazole, polyamide, and copolymers thereof, (B) a photo-acid generator, and (C) a solvent, wherein the (C) solvent includes a (C1) certain ketone compound and/or a (C2) certain ketone compound.
Inventors:
TANAKA SUSUMU (JP)
KAMOGAWA MASAO (JP)
KAMEMOTO SATOSHI (JP)
YUBA TOMOYUKI (JP)
KAMOGAWA MASAO (JP)
KAMEMOTO SATOSHI (JP)
YUBA TOMOYUKI (JP)
Application Number:
PCT/JP2023/034069
Publication Date:
April 04, 2024
Filing Date:
September 20, 2023
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/039; C08G73/10
Domestic Patent References:
| WO2017038664A1 | 2017-03-09 | |||
| WO2021125080A1 | 2021-06-24 |
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