Title:
PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN SHEET, METHOD FOR PRODUCING HOLLOW STRUCTURE, AND ELECTRONIC COMPONENT
Document Type and Number:
WIPO Patent Application WO/2020/196139
Kind Code:
A1
Abstract:
A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol·cm). (In general formula (1), R1 represents a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, -NR3R4, C1-20 monovalent hydrocarbon group, C1-20 acyl group, or C1-20 alkoxy group, and R3 and R4 each independently represent a hydrogen atom or C1-10 alkyl group, provided that at least a portion of the hydrogen atoms in the hydrocarbon group, acyl group, and alkoxy group may be substituted by a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, or -NR3R4, and a hydrocarbon group present in the hydrocarbon group, in the acyl group, or in the alkoxy group may be interrupted by an ether bond, thioether bond, ester bond, thioester bond, amide bond, or urethane bond. R2 represents a C1-5 alkyl group. The symbol * in the formula indicates bonding with a neighboring group via the * moiety.) The photosensitive resin composition according to the present invention is also a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, and (d) at least two species of oxime ester-type photopolymerization initiators. The photosensitive resin composition according to the present invention enables a high-sensitivity, high-quality photographic patterning of the cap portion of a hollow structure. A photosensitive resin sheet that uses the photosensitive resin composition according to the present invention is useful for application to the cap of the hollow structure of an electronic component that includes a hollow structure.
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Inventors:
KATSURADA YUKI (JP)
KAWANO TOMOTAKA (JP)
KANAMORI DAISUKE (JP)
KAWANO TOMOTAKA (JP)
KANAMORI DAISUKE (JP)
Application Number:
PCT/JP2020/011900
Publication Date:
October 01, 2020
Filing Date:
March 18, 2020
Export Citation:
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
H01L23/02; C08F2/50; G03F7/028; G03F7/031; G03F7/037; G03F7/09; G03F7/20; H03H3/08
Domestic Patent References:
| WO2018173840A1 | 2018-09-27 | |||
| WO2018052024A1 | 2018-03-22 | |||
| WO2018043250A1 | 2018-03-08 | |||
| WO2018173840A1 | 2018-09-27 | |||
| WO2012002028A1 | 2012-01-05 | |||
| WO2015036910A1 | 2015-03-19 | |||
| WO2008078678A1 | 2008-07-03 |
Foreign References:
| JP2018070829A | 2018-05-10 | |||
| JP2017008219A | 2017-01-12 | |||
| JP2010010812A | 2010-01-14 |
Other References:
See also references of EP 3933906A4
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