Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE-RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2015/016362
Kind Code:
A1
Abstract:
This invention pertains to a photosensitive-resin composition containing the following: (A) an acid-modified-vinyl-group-containing epoxy resin; (B) an acyl-phosphine-oxide photopolymerization initiator; (C) one or more additives selected from among (C1) alkylamino-benzene derivatives, (C2) pyrazoline sensitizers or anthracene sensitizers, (C3) one or more photopolymerization initiators selected from among imidazole photopolymerization initiators, acridine photopolymerization initiators, and titanocene photopolymerization initiators, (C4) one or more antioxidants selected from among hindered-phenol antioxidants, quinone antioxidants, amine antioxidants, sulfur antioxidants, and phosphorus antioxidants, and (C5) thiol-group-containing compounds; and (D) a photopolymerizable compound.

Inventors:
FUSE YOSHIAKI (JP)
YOSHINO TOSHIZUMI (JP)
KOJIMA MASAYUKI (JP)
OOSAKI SHINYA (JP)
SATOU KUNIAKI (JP)
Application Number:
PCT/JP2014/070400
Publication Date:
February 05, 2015
Filing Date:
August 01, 2014
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
G03F7/004; C08F290/14; C08G59/17; G03F7/027; G03F7/029; H01L21/027; H05K3/28
Foreign References:
JP2007052392A2007-03-01
JP2007078890A2007-03-29
JP2007256788A2007-10-04
JP2012123410A2012-06-28
Attorney, Agent or Firm:
OHTANI, Tamotsu et al. (JP)
Tamotsu Otani (JP)
Download PDF: