Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2018/155188
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition which is capable of forming a positive resist film that has excellent thermal shape retainability. A photosensitive resin composition according to the present invention contains a polymer that has a monomer unit represented by general formula (I) and a polyamide-imide.
(In general formula (I), R1 represents a chemical single bond or an optionally substituted divalent hydrocarbon group having 1-6 carbon atoms; and R2 represents a hydrogen atom or an optionally substituted monovalent hydrocarbon group having 1-6 carbon atoms.)
Inventors:
SAKURAI TAKAAKI (JP)
Application Number:
PCT/JP2018/004246
Publication Date:
August 30, 2018
Filing Date:
February 07, 2018
Export Citation:
Assignee:
ZEON CORP (JP)
International Classes:
G03F7/023; C08F12/24; C08F20/10; G03F7/004; H01L51/50; H05B33/22
Domestic Patent References:
| WO2016171179A1 | 2016-10-27 | |||
| WO2016143580A1 | 2016-09-15 | |||
| WO2017022547A1 | 2017-02-09 | |||
| WO2016060237A1 | 2016-04-21 |
Foreign References:
| JP2008083359A | 2008-04-10 | |||
| JP2008268788A | 2008-11-06 | |||
| JP2011071424A | 2011-04-07 | |||
| JP2009185255A | 2009-08-20 |
Attorney, Agent or Firm:
SUGIMURA Kenji (JP)
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