Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/241581
Kind Code:
A1
Abstract:
Provided is a photosensitive resin composition that includes a component (A) that is an alkali-soluble resin, component (A) including a component (a1) that is a biphenyl aralkyl phenol resin, the tensile elongation of a cured film of the photosensitive resin composition measured in condition 1 shown below being 10-200% inclusive.
Condition 1: (i) A cured film obtained by curing the photosensitive resin composition at 200°C for 180 minutes is formed, and a sample measuring 6.5 mm × 20 mm × 10 µm in thickness is prepared from the cured film. (ii) The tensile elongation is derived based on JIS K7161 by performing a tensile test on the sample at 23°C and a testing speed of 5 mm/min.
Inventors:
KITAHATA TARO (JP)
MORI SEIJI (JP)
MORI SEIJI (JP)
Application Number:
PCT/JP2021/019805
Publication Date:
December 02, 2021
Filing Date:
May 25, 2021
Export Citation:
Assignee:
SUMITOMO BAKELITE CO (JP)
International Classes:
G03F7/004; G03F7/023; G03F7/075; H01L21/312
Foreign References:
| JP2019109425A | 2019-07-04 | |||
| JP2012123378A | 2012-06-28 | |||
| JP2019101052A | 2019-06-24 |
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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