Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/210788
Kind Code:
A1
Abstract:
The present invention provides: a photosensitive resin composition which enables the achievement of a cured product that has excellent limiting resolution and dielectric characteristics; a photosensitive resin composition which enables the achievement of a cured product that has good limiting resolution, good via hole shape and excellent dielectric characteristics; and the like. A photosensitive resin composition which contains (A) a polyimide precursor having an indane skeleton, (B) a crosslinking agent, and (C) a photoradical generator. A photosensitive resin composition which contains (A) a polyimide precursor having an indane skeleton, (B) a crosslinking agent, (C) a photoradical generator, and (D) an allyl compound which has an ethylenically unsaturated bond, wherein the carbon atom in the α-position of the ethylenically unsaturated bond is bonded to a group that is selected from among a hydrocarbon group and a hydrogen atom, and at least one group bonded to the carbon atom in the α-position of the ethylenically unsaturated bond is a hydrogen atom.
Inventors:
NAGASHIMA MASAKI (JP)
MIYANAKA KENTO (JP)
TAKEDA TAKANOBU (JP)
MIYANAKA KENTO (JP)
TAKEDA TAKANOBU (JP)
Application Number:
PCT/JP2022/015696
Publication Date:
October 06, 2022
Filing Date:
March 29, 2022
Export Citation:
Assignee:
AJINOMOTO KK (JP)
International Classes:
G03F7/027; C08F290/14; C08G73/10; C08G73/12; G03F7/004; G03F7/20
Foreign References:
| JP2003076017A | 2003-03-14 | |||
| JP2020160328A | 2020-10-01 | |||
| JP2020056934A | 2020-04-09 | |||
| JP2012514760A | 2012-06-28 |
Attorney, Agent or Firm:
SAKAI INTERNATIONAL PATENT OFFICE (JP)
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