Title:
PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2024/053579
Kind Code:
A1
Abstract:
The present invention provides: a photosensitive resin composition which is capable of forming a resin film that has excellent photolithographic characteristics and excellent chemical resistance; a cured product of this photosensitive resin composition; a microlens which is formed of this cured product; a method for producing a cured product with use of this photosensitive resin composition; and a method for producing an optical element with use of this photosensitive resin composition. This photosensitive resin composition contains (A) a polyhydroxystyrene resin, (B) a photoacid generator and (C) a methylol-type crosslinking agent; and this photosensitive resin composition uses a polyhydroxystyrene resin (A) wherein some of phenolic hydroxyl groups are protected with acetal protecting groups, and a methylol-type crosslinking agent (C) which is a compound that has two or more groups selected from among a methylol group, an alkoxymethyl group and an acyloxymethyl group in each molecule.
More Like This:
Inventors:
YASUI TAIKI (JP)
ISOBE SHINGO (JP)
ISOBE SHINGO (JP)
Application Number:
PCT/JP2023/032086
Publication Date:
March 14, 2024
Filing Date:
September 01, 2023
Export Citation:
Assignee:
TOKYO OHKA KOGYO CO LTD (JP)
International Classes:
G03F7/004; G02B1/04; G03F7/039; G03F7/40
Foreign References:
| JPH05249682A | 1993-09-28 | |||
| JP2002049156A | 2002-02-15 | |||
| JP2019074731A | 2019-05-16 | |||
| JP2020100793A | 2020-07-02 |
Attorney, Agent or Firm:
SHOBAYASHI Masayuki et al. (JP)
Download PDF: