Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PHOTOSENSITIVE RESIN PRINTING PLATE PRECURSOR
Document Type and Number:
WIPO Patent Application WO/2023/026724
Kind Code:
A1
Abstract:
The objective of the present invention is to provide a photosensitive resin printing plate precursor in which an infrared-sensitive layer has excellent scratch resistance. The present invention is a photosensitive resin printing plate precursor having, on a support, a photosensitive resin layer, an intermediate layer, and an infrared-sensitive layer in this order, wherein the intermediate layer contains a polyvinyl alcohol having a saponification degree of 60-100 mol % and an average polymerization degree of 1,200-3,000.

More Like This:
JP2009282142PATTERN FORMING METHOD
JP4281924Polymer for semiconductor fine gap filling and coating composition using this
JP6697416Resist underlayer film material, pattern forming method, resist underlayer film forming method, and compounds for resist underlayer film material
Inventors:
ABURA TSUTOMU (JP)
Application Number:
PCT/JP2022/028164
Publication Date:
March 02, 2023
Filing Date:
July 20, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TORAY INDUSTRIES (JP)
International Classes:
G03F7/11; B41N1/12; G03F7/00; G03F7/004; G03F7/033; G03F7/039; G03F7/095
Domestic Patent References:
WO2021039263A12021-03-04
WO2010070918A12010-06-24
WO2017056763A12017-04-06
WO2017038970A12017-03-09
Foreign References:
JP2014119594A2014-06-30
JP2015176066A2015-10-05
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: POLISHING DEVICE

Next Patent: STORAGE SOLUTION FOR CELL-CONTAINING SOLUTION AND STORAGE CONTAINER FOR CELL-CONTAINING SOLUTION