Title:
PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION, DRY FILM, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2020/110671
Kind Code:
A1
Abstract:
Provided are: a photosensitive thermosetting resin composition that can be developed using a weak-alkaline aqueous sodium carbonate solution, and has excellent photosensitivity, and excellent mechanical properties, such as heat resistance and flexibility; a dry film; and a printed wiring board. This photosensitive thermosetting resin composition is characterized by containing (A) an alkali-soluble polyamide imide resin, (B) a resin having an unsaturated double bond and a carboxyl group, (C) a thermosetting cyclic ether group-containing compound, and (D) a photopolymerization initiator, wherein the alkali-soluble polyamide imide resin (A) has a structure represented by general formula (1) and a structure represented by general formula (2) (X1 represents a residue of a dimer acid-derived aliphatic diamine (a) having 24-48 carbon atoms, X2 represents a residue of an aromatic diamine (b) having a carboxyl group, and each occurrence of Y independently represents a cyclohexane ring or an aromatic ring).
Inventors:
MIYABE HIDEKAZU (JP)
YONEDA KAZUYOSHI (JP)
YONEDA KAZUYOSHI (JP)
Application Number:
PCT/JP2019/043984
Publication Date:
June 04, 2020
Filing Date:
November 08, 2019
Export Citation:
Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
C08G73/10; G03F7/004; G03F7/027; G03F7/031; G03F7/037; H05K3/28
Foreign References:
| JP2012098470A | 2012-05-24 | |||
| JP2017036407A | 2017-02-16 | |||
| JP2018172533A | 2018-11-08 |
Attorney, Agent or Firm:
HONDA Ichiro (JP)
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