Title:
PHOTOSENSITIVE TRANSFER MEMBER, METHOD FOR PRODUCING RESIN PATTERN, METHOD FOR PRODUCING CIRCUIT WIRING, AND METHOD FOR PRODUCING TOUCH PANEL
Document Type and Number:
WIPO Patent Application WO/2021/060148
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing: a photosensitive transfer member having excellent laminating properties and being capable of suppressing the occurrence of blocking when a temporary support body and a thermoplastic resin layer are peeled off; a method for producing a resin pattern; a method for producing circuit wiring; and a method for producing a touch panel. A photosensitive transfer member according to the present invention includes a temporary support body, a thermoplastic resin layer, a photosensitive resin layer, and a cover film, in the stated order, wherein: the thermoplastic resin layer has a Vicat softening point of 50°C to 120°C and a tensile modulus of 10 to 200 MPa; and the peeling strength between the temporary support body and the thermoplastic resin layer is greater than the peeling strength between the thermoplastic resin layer and the photosensitive resin layer.
Inventors:
SATO MORIMASA (JP)
Application Number:
PCT/JP2020/035288
Publication Date:
April 01, 2021
Filing Date:
September 17, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/004; G03F7/027; G03F7/09; G03F7/11; G03F7/20; G03F7/38; G06F3/041; H05K3/06
Foreign References:
| JPH09179306A | 1997-07-11 | |||
| JPH05273743A | 1993-10-22 | |||
| JPH05273759A | 1993-10-22 | |||
| JP2005286308A | 2005-10-13 |
Attorney, Agent or Firm:
ITOH Hideaki et al. (JP)
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