Title:
PHOTOSENSITIVE TRANSFERRING MATERIAL AND METHOD FOR PRODUCING CIRCUIT WIRING
Document Type and Number:
WIPO Patent Application WO/2018/179641
Kind Code:
A1
Abstract:
Disclosed is a photosensitive transferring material comprising: a temporary support; and a photosensitive resin composition layer including a photoacid generator, and a polymer component including a polymer that includes a constituent unit (a-1) including a group wherein a carboxy group is protected in the form of an acetal, or a constituent unit (a-2) including a group in which a phenolic hydroxyl group is protected in the form of an acetal. The polymer component includes a constituent unit (b-1) including a phenolic hydroxyl group and/or a constituent unit (b-2) including an alcoholic hydroxyl group. The total percentage of the constituent unit (b-1) and the constituent unit (b-2) in all of the constituent units in the polymer component is from 1 mol% to 18 mol%. Also disclosed is a method for producing a circuit wiring using the photosensitive transferring material.
Inventors:
FUJIMOTO SHINJI (JP)
MATSUDA TOMOKI (JP)
YAMADA SATORU (JP)
MATSUDA TOMOKI (JP)
YAMADA SATORU (JP)
Application Number:
PCT/JP2017/046479
Publication Date:
October 04, 2018
Filing Date:
December 25, 2017
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
G03F7/039; C08F12/08; C08F20/16; G03F7/004; G03F7/20
Foreign References:
| JP2014010382A | 2014-01-20 | |||
| JP2013083844A | 2013-05-09 | |||
| JP2013083698A | 2013-05-09 | |||
| JP2013080192A | 2013-05-02 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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