Title:
PHOTOTHERMIC DESOLDERING UNIT
Document Type and Number:
WIPO Patent Application WO/2008/006239
Kind Code:
A1
Abstract:
A photothermic desoldering unit comprises: a unit container(1); an upper cover
plate(2), which covers the opening of the unit container, and fixes multiple
fans (211,222) under hollow-out parts; a heating cover(4), in which an intake
port(42) corresponding to a part of fans in the upper cover plate is provided at
the bottom of depressed part, and there is an engagement with clearance between
the bottom of the heating cover and the upper cover plate; and a fixation mechanism
for circuit board (3), which is provided at the upper cover plate and can hold the
circuit board to be desoldered with different size in length and width.
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| JP6100347 | Solder removal system |
Inventors:
HSIAO YU-JU (CN)
Application Number:
PCT/CN2006/001328
Publication Date:
January 17, 2008
Filing Date:
June 14, 2006
Export Citation:
Assignee:
HSIAO YU-JU (CN)
International Classes:
B23K1/018; B23K3/04
Foreign References:
| CN2452667Y | 2001-10-10 | |||
| US6301436B1 | 2001-10-09 | |||
| US6698649B2 | 2004-03-02 | |||
| US4506820A | 1985-03-26 | |||
| US4972990A | 1990-11-27 | |||
| JP2003092466A | 2003-03-28 |
Attorney, Agent or Firm:
BEIJING SANYOU INTELLECTUAL PROPERTY AGENCY LTD. (Corporate SquareNo. 35 Jinrong Street, Beijing 2, CN)
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