Title:
PHYSICAL QUANTITY MEASUREMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/209268
Kind Code:
A1
Abstract:
This invention reduces thermal stress near an interface with a housing sealing member and ensures wire connection reliability in a simple manner. A physical quantity measurement device 20 comprises a housing 100, a connector terminal 117 sealed in the housing 100, a wire 350 bonded to the connector terminal 117, and a sealing member 250 that seals the wire 350 and is in contact with the connector terminal 117 and housing 100. The linear expansion coefficient of the housing 100 is greater than that of the sealing member 250. The connector terminal 117 comprises a bonding surface 118 and a lateral surface 119 that is continuous with the bonding surface 118 and is sealed by the housing 100. The housing 100 comprises a first surface 115 that is in contact with the lateral surface 119 and a second surface 116 that is continuous with the first surface 115 and is in contact with the sealing member 250. The end part 116a of the second surface 116 that is continuous with the first surface 115 is formed into a shape that is flush with the bonding surface 118.
Inventors:
ISHITSUKA NORIO (JP)
UENODAN AKIRA (JP)
YATSUMONJI NOZOMI (JP)
IJUIN MIZUKI (JP)
YOGO TAKAYUKI (JP)
UENODAN AKIRA (JP)
YATSUMONJI NOZOMI (JP)
IJUIN MIZUKI (JP)
YOGO TAKAYUKI (JP)
Application Number:
PCT/JP2022/004127
Publication Date:
October 06, 2022
Filing Date:
February 02, 2022
Export Citation:
Assignee:
HITACHI ASTEMO LTD (JP)
International Classes:
G01F1/684
Foreign References:
| JP2003130700A | 2003-05-08 | |||
| JP2018096728A | 2018-06-21 | |||
| JP2020201205A | 2020-12-17 | |||
| JP2004028631A | 2004-01-29 | |||
| JPH11132808A | 1999-05-21 |
Attorney, Agent or Firm:
HIRAKI & ASSOCIATES (JP)
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