Title:
PIEZOELECTRIC DEVICE PACKAGE AND PIEZOELECTRIC DEVICE
Document Type and Number:
WIPO Patent Application WO/2015/115388
Kind Code:
A1
Abstract:
In the present invention, when installing a piezoelectric oscillation piece in a main package body, the spread of adhesive to an oscillation unit is mitigated by restricting the direction in which the adhesive spreads along the rear surface of the piezoelectric oscillation piece, and the CI value of the piezoelectric oscillation piece is prevented from worsening. A piezoelectric device package (10) has a main package body (10a) for holding the piezoelectric oscillation piece (50), and connective electrodes (23, 24) which are electrically connected to excitation electrodes (53, 54) formed on the piezoelectric oscillation piece (50) are provided in the main package body (10a). The connective electrodes (23, 24) are provided with cutouts (25, 26) formed in the oscillation part (51) side of the piezoelectric oscillation piece (50) held in the main package body (10a).
Inventors:
ASAMIZU TAKASHI (JP)
Application Number:
PCT/JP2015/052094
Publication Date:
August 06, 2015
Filing Date:
January 27, 2015
Export Citation:
Assignee:
NIHON DEMPA KOGYO CO (JP)
International Classes:
H01L23/12; H01L23/08; H03B5/32; H03H9/02; H03H9/10
Foreign References:
| JP2009117902A | 2009-05-28 | |||
| JP2003318692A | 2003-11-07 | |||
| JP2002198767A | 2002-07-12 |
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