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Patent Searching and Data


Title:
PIEZOELECTRIC FILM SENSOR
Document Type and Number:
WIPO Patent Application WO/2016/027615
Kind Code:
A1
Abstract:
A sensor part (11) is provided with two main surfaces facing each other. Flat film-like piezoelectric films (111a, 111b) are laminated between the main surfaces, and conductive connection patterns (112a, 113a) for outputting piezoelectric voltages corresponding to the amounts of strain of the piezoelectric films (111a, 111b) are formed. A rigid circuit part (12) is obtained by forming, on a main surface of a circuit substrate (200), conductive connection patterns (200a, 200b) that are electrically connected to the connection patterns (112a, 113a) of the sensor part (11) and a processing circuit (201) for processing the piezoelectric voltages corresponding to the amounts of strain of the piezoelectric films (111a, 111b), said piezoelectric voltages being inputted via the connection patterns (200a, 200b). Holding members (13a, 13b) hold the sensor part (11) and the circuit part (12) in such a manner that the connection patterns (112a, 113a) and the connection patterns (200a, 200b) are in pressure contact with each other.

Inventors:
KAWAMURA HIDEKI (JP)
Application Number:
PCT/JP2015/071061
Publication Date:
February 25, 2016
Filing Date:
July 24, 2015
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
G01L1/16; A61B5/0245
Domestic Patent References:
WO2013111841A12013-08-01
Foreign References:
JP2014074618A2014-04-24
JPS5299869A1977-08-22
JP2007286064A2007-11-01
JPH09236504A1997-09-09
JP2005261464A2005-09-29
JPH10332509A1998-12-18
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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