Title:
PIEZOELECTRIC MEMS MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2022/007002
Kind Code:
A1
Abstract:
The present utility model provides a piezoelectric MEMS microphone, comprising a base having a back cavity and a piezoelectric vibrating diaphragm. The piezoelectric vibrating diaphragm comprises an anchoring part fixedly supported by the base and a cantilever beam integrally formed with the anchoring part, wherein the cantilever beam is suspended above the back cavity, the cantilever beam comprises a first electrode layer, a piezoelectric material layer and a second electrode layer which are sequentially stacked in the thickness direction, and the piezoelectric vibrating diaphragm further comprises a plurality of stress layers which are fixedly attached to at least any one of the first electrode layer, the piezoelectric material layer and the second electrode layer and are arranged at intervals. According to the solution, the plurality of stress layers are arranged at intervals on the cantilever beam structure of the piezoelectric vibrating diaphragm, so that the gradient stress generated by the piezoelectric vibrating diaphragm in the deposition process of the piezoelectric material can be compensated, the warping deformation of the piezoelectric vibrating diaphragm under the action of stress and gradient stress is reduced, and the performance of the piezoelectric MEMS microphone is guaranteed.
Inventors:
DUAN LIAN (CN)
ZHANG RUI (CN)
ZHANG RUI (CN)
Application Number:
PCT/CN2020/103769
Publication Date:
January 13, 2022
Filing Date:
July 23, 2020
Export Citation:
Assignee:
AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)
International Classes:
H04R19/04; H04R17/02; H04R23/02
Foreign References:
| JP2018137297A | 2018-08-30 | |||
| CN110475191A | 2019-11-19 | |||
| CN109941956A | 2019-06-28 | |||
| CN104333838A | 2015-02-04 | |||
| CN208987175U | 2019-06-14 |
Attorney, Agent or Firm:
HENSEN INTELLECTUAL PROPERTY FIRM (CN)
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