PIEZOELECTRIC MEMS MICROPHONE

WIPO Patent Application WO/2022/110416

A1

Provided in the present application is a piezoelectric MEMS microphone, comprising at least one piezoelectric MEMS unit, the piezoelectric MEMS unit comprising a substrate, the substrate comprising an annular peripheral wall enclosing an accommodating cavity and a support structure disposed in the accommodating cavity, the support structure comprising a support part spaced apart from the peripheral wall and a plurality of extension arms extending from the peripheral wall to the support part; and a diaphragm structure, the diaphragm structure being an integral structure and comprising a fixed area and a plurality of moving parts, the fixed area comprising an anchoring part and a plurality of anchoring arms extending radially from the edge of the anchoring part, the anchoring part being fixed to the support part, the anchoring arms being fixed to the extension arms, and each moving part surrounding the anchoring part and being spaced apart from the anchoring arms. The diaphragm structure of the present application is fixed onto the substrate by means of the anchoring part and the plurality of anchoring arms extending radially from the edge of the anchoring part, increasing the contact area of the diaphragm structure and the substrate, and thereby effectively reducing the risk of the diaphragm structure peeling off the substrate.

TONG BEI (CN)
SHI ZHENGYU (CN)
SHEN YU (CN)
DUAN LIAN (CN)

PCT/CN2020/138446

June 02, 2022

December 23, 2020

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AAC ACOUSTIC TECH SHENZHEN CO LTD (CN)

H04R19/04; H04R17/02; H04R23/02

CN110545514A	2019-12-06
CN111225330A	2020-06-02
CN102868383A	2013-01-09
CN101568054A	2009-10-28

SHENZHEN CHINA INNOVATION SOUTH INTELLECTUAL PROPERTY AGENCY CO., LTD. (CN)

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