Title:
PIEZOELECTRIC MICROPHONE
Document Type and Number:
WIPO Patent Application WO/2018/214321
Kind Code:
A1
Abstract:
Disclosed in the present invention is a piezoelectric microphone, comprising a substrate having a rear cavity, and a piezoelectric film connected to above the substrate via an insulation layer. Multiple through holes are provided in the piezoelectric film that extend to inner sides of the connection points between the piezoelectric film and the substrate. The through holes on the piezoelectric film at least partially overlap the substrate. There is a gap between the substrate and the position of each of the through holes on the piezoelectric film, and the gap and said through hole form a channel. In contrast to conventional through hole structures, the gap in the present invention prevents sound from being directly transmitted to the outside via a through hole, thus significantly lowering leakage of low and middle frequency signals of the piezoelectric microphone, and improving performance thereof. The gap can also effectively prevent dust, micro-particles, and moisture ingress from damaging a chip.
Inventors:
ZHAN JUNKAI (CN)
ZHOU ZONGLIN (CN)
CAI MENGJIN (CN)
ZHOU ZONGLIN (CN)
CAI MENGJIN (CN)
Application Number:
PCT/CN2017/099519
Publication Date:
November 29, 2018
Filing Date:
August 29, 2017
Export Citation:
Assignee:
GOERTEK INC (CN)
International Classes:
H04R17/02
Foreign References:
CN107071672A | 2017-08-18 | |||
CN102545827A | 2012-07-04 | |||
CN206164826U | 2017-05-10 | |||
CN104202010A | 2014-12-10 | |||
US5889352A | 1999-03-30 |
Other References:
See also references of EP 3432602A4
Attorney, Agent or Firm:
BEYOND TALENT PATENT AGENT FIRM (CN)
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