Title:
PIEZOELECTRIC VIBRATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/158010
Kind Code:
A1
Abstract:
[Problem] To make it possible to stably bond an external element in a piezoelectric vibration device having a sandwich structure.
[Solution] In a piezoelectric vibration device 1, at least a vibrating section 21 of a piezoelectric substrate 2 is sealed by means of a first sealing member 3 and a second sealing member 4. The piezoelectric substrate 2 is provided with the vibrating section 21, and an outer frame section 23, which surrounds the outer periphery of the vibrating section 21, and which is formed thicker than the vibrating section 21. The first sealing member 3 and/or the second sealing member 4 is provided with an external electrode 31 to which an external element 5 is connected, and at least at the outer frame section 23 of the piezoelectric substrate 2, the external element 5 is connected to the external electrode 31.
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Inventors:
KOJO TAKUYA (JP)
ISHINO SATORU (JP)
ISHINO SATORU (JP)
Application Number:
PCT/JP2016/053579
Publication Date:
October 06, 2016
Filing Date:
February 05, 2016
Export Citation:
Assignee:
DAISHINKU CORP (JP)
International Classes:
H03B5/32; H01L23/04
Foreign References:
| JP2009165102A | 2009-07-23 | |||
| US20080079334A1 | 2008-04-03 | |||
| JP2011166352A | 2011-08-25 | |||
| JP2006060638A | 2006-03-02 |
Attorney, Agent or Firm:
ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
Patent business corporation ARC PATENT ATTORNEYS' OFFICE (JP)
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