Title:
PIN GRID ARRAY SOCKET WITH REINFORCEMENT PLATE
Document Type and Number:
WIPO Patent Application WO2002069684
Kind Code:
A3
Abstract:
A socket for a PGA package can maintain high reliability of connecting condition for a long period. The socket is constructed by mounting a reinforcement plate formed with a metal plate or the like at the position where the cam member contacts the slide plate so that the slide plate, which is formed of an insulative materials such as plastic or the like, will not be deformed upon exertion of a reaction force from a plurality of lead pins of a PGA package.
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Inventors:
HIRATA TOSHIHISA (JP)
SASAO MASAMI (JP)
SASAO MASAMI (JP)
Application Number:
PCT/US2002/005459
Publication Date:
December 05, 2002
Filing Date:
February 22, 2002
Export Citation:
Assignee:
MOLEX INC (US)
HIRATA TOSHIHISA (JP)
SASAO MASAMI (JP)
HIRATA TOSHIHISA (JP)
SASAO MASAMI (JP)
International Classes:
H01L23/32; H01R33/76; H05K7/10; H01R13/193; (IPC1-7): H05K7/10; H01R13/193
Foreign References:
| EP1006618A2 | 2000-06-07 |
Other References:
PATENT ABSTRACTS OF JAPAN vol. 1999, no. 07 31 March 1999 (1999-03-31)
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