Title:
PIN SOLDERING TOOL AND PIN FIXING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/181828
Kind Code:
A1
Abstract:
A pin (A) soldering tool and a pin (A) fixing method. The pin (A) soldering tool comprises a base portion (1) and a gland portion (2). A groove (101) is formed on an upper end of the base portion (1). The gland portion (2) matches above the base portion (1). Several vertically-through positioning holes (201) are formed on the gland portion (2). The positioning holes (201) cover above the groove (101) after the gland portion (2) matches the base portion (1). The gland portion (2) is provided with an elastomer (3) used for fixing the pin (A) according to the layout of the positioning holes (201). The elastomer (3) carries the fixed pin (A) to extend into the groove (101) and contact with a ceramic copper clad laminate (B) placed in the groove (101) for soldering after the elastomer (3) is removed. According to the tool, the pin (A) and the ceramic copper clad laminate (B) are tightly connected to each other after being soldered by means of a solder paste, which prevents the pin (A) and the ceramic copper clad laminate (B) from loosening after soldering. The soldering effect is good and the soldering is firm.
Inventors:
ZHANG RU (CN)
ZANG TIANCHENG (CN)
AN YONG (CN)
JIN HAO (CN)
WANG SUGE (CN)
ZANG TIANCHENG (CN)
AN YONG (CN)
JIN HAO (CN)
WANG SUGE (CN)
Application Number:
PCT/CN2019/119749
Publication Date:
September 17, 2020
Filing Date:
November 20, 2019
Export Citation:
Assignee:
YANTAI TAIXIN ELECTRONIC TECH CO LTD (CN)
International Classes:
B23K3/08
Foreign References:
| CN109732173A | 2019-05-10 | |||
| CN205888317U | 2017-01-18 | |||
| CN107813028A | 2018-03-20 | |||
| CN204094281U | 2015-01-14 | |||
| CN108336622A | 2018-07-27 | |||
| JP2003142813A | 2003-05-16 |
Attorney, Agent or Firm:
BEIJING ZHONGCHUANG BOTEN INTELLECTUAL PROPERTY AGENCY (GENERAL PARTNERSHIP) (CN)
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