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Patent Searching and Data


Title:
PIPE-BENDING MOLD UNIT AND PIPE-BENDING MACHINING DEVICE COMPRISING SAID UNIT
Document Type and Number:
WIPO Patent Application WO/2015/190465
Kind Code:
A1
Abstract:
Provided are: a pipe-bending mold unit capable of appropriately performing bending work on a pipe without the risk of wrinkles occurring; and a pipe-bending machining device comprising said unit and having easy setup changes. A bending mold (100) comprises: a gripping member (10) having, in the outer circumferential surface thereof, a first groove section (11) that has a semi-circular cross-section, said gripping member also having a recessed engagement section (12) formed inside the first groove section and extending for a first prescribed distance in the circumferential direction inside a plane orthogonal to the axis of rotation (A); and a pressuring member (20) having in the outer circumferential surface thereof a second groove section (21) that has a semi-circular cross-section, said pressuring member also having a protruding engagement section (2) extending for a second prescribed distance in the circumferential direction from a tip section of the second groove section. The protruding engagement section is fitted into the recessed engagement section and a pipe reception groove having a semi-circular cross-section is formed by the first groove section and the second groove section. The pressuring member and the gripping member are coupled by a hinge joint having the axis of rotation as the center thereof and are relatively and rotatably supported, around the axis of rotation.

Inventors:
NOZU KENTARO (JP)
Application Number:
PCT/JP2015/066571
Publication Date:
December 17, 2015
Filing Date:
June 09, 2015
Export Citation:
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Assignee:
SANGO CO LTD (JP)
International Classes:
B21D7/025
Foreign References:
JPS5271368A1977-06-14
JP2012055952A2012-03-22
JP2010167470A2010-08-05
JP2004009125A2004-01-15
US6009737A2000-01-04
Other References:
See also references of EP 3156144A4
Attorney, Agent or Firm:
IKEDA KAZUMA (JP)
Ikeda 1 truth (JP)
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