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Patent Searching and Data


Title:
PLANARIZATION METHOD AND PHOTOCURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2021/256327
Kind Code:
A1
Abstract:
A substrate surface planarization method includes an arranging step of arranging a liquid curable composition onto a substrate surface having unevenness, a waiting step of waiting until the surface of the layer of the liquid curable composition becomes smooth, and a light exposure step of applying light to cure the layer of the liquid curable composition in this order. The arranging step includes a first arranging step of arranging a layer made of a first liquid curable composition (A1) containing at least a polymerizable compound (a1), and a second arranging step of arranging droplets of a second liquid curable composition (A2) containing at least a polymerizable compound (a2) onto the layer made of the first liquid curable composition (A1) by dropping the droplets discretely.

Inventors:
ITO TOSHIKI (JP)
KIYOHARA NAOKI (JP)
CHIBA KEIKO (JP)
STACHOWIAK TIMOTHY BRIAN (JP)
YAMASHITA KEIJI (JP)
Application Number:
PCT/JP2021/021718
Publication Date:
December 23, 2021
Filing Date:
June 08, 2021
Export Citation:
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Assignee:
CANON KK (JP)
International Classes:
H01L21/027
Foreign References:
US20200166836A12020-05-28
US20100012622A12010-01-21
US20200171716A12020-06-04
JP2019062057A2019-04-18
Attorney, Agent or Firm:
OKABE Yuzuru et al. (JP)
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