Title:
PLANARIZED FILM-FORMING APPLICATION LIQUID, METHOD FOR PRODUCING PLANARIZED FILM-FORMING APPLICATION LIQUID, METALLIC FOIL PROVIDED WITH PLANARIZED FILM, METHOD FOR PRODUCING METALLIC FOIL PROVIDED WITH PLANARIZED FILM
Document Type and Number:
WIPO Patent Application WO/2020/067467
Kind Code:
A1
Abstract:
This planarized film-forming application liquid contains phenylsilsesquioxane which is soluble in an organic solvent, wherein the planarized film-forming application liquid has a viscosity of 2.5-35 mPa·s when the solid concentration of the phenylsilsesquioxane is 30 mass%, and the amount of alkoxy groups bound to Si in the phenylsilsesquioxane is 0-5% with respect to Si.
Inventors:
YAMADA NORIKO (JP)
YAMAGUCHI SAWAKO (JP)
SEKIGUCHI YUTAKA (JP)
YAMAGUCHI SAWAKO (JP)
SEKIGUCHI YUTAKA (JP)
Application Number:
PCT/JP2019/038250
Publication Date:
April 02, 2020
Filing Date:
September 27, 2019
Export Citation:
Assignee:
NIPPON STEEL CORP (JP)
International Classes:
C09D183/04; C23C26/00
Domestic Patent References:
| WO2016076399A1 | 2016-05-19 |
Foreign References:
| JP2018123192A | 2018-08-09 | |||
| JP2018062582A | 2018-04-19 | |||
| JP2017155309A | 2017-09-07 | |||
| JP2012140528A | 2012-07-26 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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