PLANE CONTACT TYPE HEAT EXCHANGER

Title:

PLANE CONTACT TYPE HEAT EXCHANGER

Document Type and Number:

WIPO Patent Application WO/2024/038704

Kind Code:

A1

Abstract:

[Problem] To reduce the cost of producing a plane contact type heat exchanger and reduce the size of the heat exchanger. [Solution] A plane contact type heat exchanger comprising: a cup plate 1 comprising a flat bottom 1a having a rim 1c around the outer periphery thereof; a flat flange plate 3, the outer periphery of which is connected to the rim 1c of the cup plate 1; and a core 2 disposed between the cup plate 1 and the flange plate 3. A channel 4 for leading a heat medium 5 into the core 2 is formed. A heat transfer surface 1b is formed in the outer surface of the bottom 1a of the cup plate 1, and an object 6 to be subjected to heat exchange is placed on the heat transfer surface 1b.

More Like This:

JP2020159612	HEAT TRANSPORT SYSTEM
JPH04176151	SEMICONDUCTOR DEVICE AND DEVICE FOR COOLING THE SAME
WO/2020/233987	ADAPTER ELEMENT FOR CONNECTING AN ELECTRONICS COMPONENT TO A HEAT SINK ELEMENT, SYSTEM COMPRISING AN ADAPTER ELEMENT OF THIS KIND, AND METHOD FOR PRODUCING AN ADAPTER ELEMENT OF THIS KIND

Inventors:

KOMURO AKIRA (JP)
KUBOTA HIRO (JP)

Application Number:

PCT/JP2023/025395

Publication Date:

February 22, 2024

Filing Date:

July 10, 2023

Export Citation:

Click for automatic bibliography generation Help

Assignee:

T RAD CO LTD (JP)

International Classes:

H01L23/473; H05K7/20

Foreign References:

JP2022065238A	2022-04-27
JP2020096123A	2020-06-18

Attorney, Agent or Firm:

KITAMURA, CHIKAHIKO (JP)

Download PDF:

View/Download PDF PDF Help

Previous Patent: LIGHT DETECTION DEVICE

Next Patent: CATIONICALLY POLYMERIZABLE RESIN COMPOSITION FOR 3D STEREOLITHOGRAPHY AND METHOD FOR PRODUCING 3D ST...