Title:
PLASMA PROCESSING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2020/116250
Kind Code:
A1
Abstract:
The present invention provides a plasma processing apparatus which is capable of suppressing the occurrence of an abnormal discharge. A plasma processing apparatus according to the present invention is provided with an upper electrode and a lower electrode, which are arranged within a processing container so as to face each other, and a dielectric shower for gas introduction, which is arranged below the upper electrode; and this plasma processing apparatus generates a plasma in the space between the upper electrode and the lower electrode. This plasma processing apparatus is configured such that the upper electrode is provided with: a slot for introducing VHF waves into the processing container; and a gas flow path which is provided independently from the slot, while being in communication with the dielectric shower.
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Inventors:
IKEDA TARO (JP)
KITAHARA TOSHIFUMI (JP)
KITAHARA TOSHIFUMI (JP)
Application Number:
PCT/JP2019/046223
Publication Date:
June 11, 2020
Filing Date:
November 26, 2019
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46; C23C16/509; H01L21/205; H01L21/3065
Domestic Patent References:
| WO2010140526A1 | 2010-12-09 |
Foreign References:
| JPH11260596A | 1999-09-24 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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