Title:
PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2011/151996
Kind Code:
A1
Abstract:
A plasma processing device comprises a stock unit (2), a processing unit (5), and an alignment chamber (4). The stock unit (2) supplies and collects a tray (7) that is capable of being conveyed, whereupon wafers (W) are housed within each of a plurality of housing holes (7a). In the processing chamber (5), plasma processing is executed on the wafers (W) that are housed in the tray (7) that is supplied from the stock unit (2). The alignment chamber (4) further comprises a rotating table (41), whereupon the tray (7) is loaded prior to the plasma processing, and the positioning of the wafers (W) is carried out upon the rotating table (41). A housing status determination unit (6b) of a control unit (6) uses heights detected with height detection sensors (44A-44D) to determine whether the wafers (W) have incurred position misalignment with regard to the housing holes (7a) of the tray (7).
Inventors:
OKITA SHOGO
ONISHI YASUHIRO
ONISHI YASUHIRO
Application Number:
PCT/JP2011/002909
Publication Date:
December 08, 2011
Filing Date:
May 25, 2011
Export Citation:
Assignee:
PANASONIC CORP (JP)
OKITA SHOGO
ONISHI YASUHIRO
OKITA SHOGO
ONISHI YASUHIRO
International Classes:
H01L21/205; H01L21/68; H01L21/3065; H01L21/677; H05H1/46
Foreign References:
| JP2009177190A | 2009-08-06 | |||
| JP2002321131A | 2002-11-05 | |||
| JPH03276092A | 1991-12-06 | |||
| JP2005142200A | 2005-06-02 | |||
| JP2009200142A | 2009-09-03 | |||
| JP2010153769A | 2010-07-08 |
Attorney, Agent or Firm:
TANAKA, Mitsuo et al. (JP)
Mitsuo Tanaka (JP)
Mitsuo Tanaka (JP)
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Claims: