Title:
PLASMA PROCESSING DEVICE AND PLASMA PROCESSING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/176542
Kind Code:
A1
Abstract:
A plasma processing device according to the present invention has: a processing vessel that has a processing space in which a substrate is disposed; a plasma generating unit that has first and second electrodes provided opposite each other and configured as parallel flat plate electrodes, and that has a plasma-generating space formed between the electrodes; a high-frequency power supply that forms a high-frequency electric field between the first electrode and the second electrode; a gas supplying unit that supplies a processing gas for generating plasma in the plasma generating space; a plasma introducing unit that introduces the plasma, generated in the plasma generating space, into the processing space; and a heat transfer member that comprises an insulator and is provided so as to thermally connect the first electrode and the second electrode, wherein the plasma introduced into the processing space is used to perform plasma processing on the substrate.
Inventors:
HIRAYAMA MASAKI (JP)
Application Number:
PCT/JP2023/008285
Publication Date:
September 21, 2023
Filing Date:
March 06, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46; C23C16/509; H01L21/205; H01L21/3065
Foreign References:
| JP2014175664A | 2014-09-22 | |||
| JP2017157627A | 2017-09-07 |
Attorney, Agent or Firm:
TAKAYAMA Hiroshi (JP)
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