Title:
PLASMA PROCESSING METHOD AND PLASMA PROCESSING DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/203406
Kind Code:
A1
Abstract:
Provided is a plasma processing method for a plasma processing device provided with a chamber, a stage for placing a substrate in the chamber, a plurality of radiating units for radiating a plurality of electromagnetic waves, and a dielectric window disposed between the plurality of radiating units and the stage, wherein the plasma processing method includes: a step of preparing the substrate on the stage; a step of controlling the phase of at least one of the plurality of electromagnetic waves radiated from the plurality of radiating units; a step of radiating the plurality of electromagnetic waves into the chamber from the plurality of radiating units; and a step of processing the substrate by means of localized plasma generated from gas supplied between the dielectric window and the stage.
Inventors:
KAMATA EIKI (JP)
SATO MIKIO (JP)
IKEDA TARO (JP)
YAMAMOTO NOBUHIKO (JP)
SATO MIKIO (JP)
IKEDA TARO (JP)
YAMAMOTO NOBUHIKO (JP)
Application Number:
PCT/JP2020/012686
Publication Date:
October 08, 2020
Filing Date:
March 23, 2020
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H05H1/46; H01L21/205; H01L21/3065
Domestic Patent References:
| WO2011040328A1 | 2011-04-07 | |||
| WO2004056159A1 | 2004-07-01 |
Foreign References:
| JP2018006256A | 2018-01-11 | |||
| JP2010163682A | 2010-07-29 | |||
| JP2017103454A | 2017-06-08 |
Attorney, Agent or Firm:
ITOH, Tadashige et al. (JP)
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