Title:
PLASMA SPRAYING FOR JOINING SILICON PARTS
Document Type and Number:
WIPO Patent Application WO2005005562
Kind Code:
A3
Abstract:
A method of joining two silicon members (32, 36) and the bonded assembly in which the members are assembled to place them into alignment across a seam (40). Silicon derived from silicon powder is plasma sprayed across the seam and forms a silicon coating (44) that bonds to the silicon members on each side of the seam to thereby bond together the members. The plasma sprayed silicon may seal an underlying bond of spin-on glass or may act as the primary bond, in which case through mortise holes are preferred so that two layers of silicon are plasma sprayed on opposing ends of the mortise holes. A silicon wafer tower (10) or boat maybe the final product. The method may be used to form a ring (128) or a tube from segments (102) or staves arranged in a circle. Plasma spraying silicon may repair a crack or chip (160) formed in a silicon member (162).
Inventors:
BOYLE JAMES E (US)
DELANEY LAURENCE (US)
DELANEY LAURENCE (US)
Application Number:
PCT/US2004/017791
Publication Date:
November 03, 2005
Filing Date:
June 04, 2004
Export Citation:
Assignee:
INTEGRATED MATERIALS INC (US)
BOYLE JAMES E (US)
DELANEY LAURENCE (US)
BOYLE JAMES E (US)
DELANEY LAURENCE (US)
International Classes:
H01L21/336; H01L21/44; H01L21/673; H01L29/792; C09J; (IPC1-7): H01L21/336; H01L29/792
Foreign References:
| US6056123A | 2000-05-02 | |||
| US5211761A | 1993-05-18 |
Other References:
See also references of EP 1636833A4
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