PLASMA TREATMENT METHOD, PLASTMA TREATMENT DEVICE AND LONG PLASMA-TREATED OBJECT

Title:

PLASMA TREATMENT METHOD, PLASTMA TREATMENT DEVICE AND LONG PLASMA-TREATED OBJECT

Document Type and Number:

WIPO Patent Application WO/2014/167626

Kind Code:

A1

Abstract:

[Problem] The purpose of the present invention is to provide a plasma treatment method, which passes a long treatment object selectively through regions of high plasma density in plasma that has variations in density distribution and is capable of even and uniform surface treatment on the surface of the object, and a plasma treatment device of excellent manageability that uses said plasma treatment method. [Solution] The present invention is: a plasma treatment method for performing plasma treatment on a long treatment object (W) by bringing the long treatment object (W) in contact with plasma, wherein there are variations in density distribution in the plasma and plasma treatment is performed as the long treatment object (W) is passed selectively through regions of high plasma density; a plasma treatment apparatus using said plasma treatment method; and a long plasma-treated object.

Inventors:

OKINO AKITOSHI (JP)
MIYAHARA HIDEKAZU (JP)
TSUTSUMI HIDENOBU (JP)
NAKAZAKI JUNJI (JP)
OGAWA TAKASHI (JP)
SUIZU KEITA (JP)

Application Number:

PCT/JP2013/060626

Publication Date:

October 16, 2014

Filing Date:

April 08, 2013

Export Citation:

Click for automatic bibliography generation Help

Assignee:

OKINO AKITOSHI (JP)
MIYAHARA HIDEKAZU (JP)
SUNLINE CO LTD (JP)

International Classes:

B01J19/08; A01K91/00; C08J7/00; D06M10/02

Foreign References:

JPH0448290U	1992-04-23
JPH05148711A	1993-06-15
JPS6474942A	1989-03-20
JPS53119400A	1978-10-18
US3746858A	1973-07-17
JP2013097904A	2013-05-20
JPH06182195A	1994-07-05
JPH04334543A	1992-11-20

Other References: