Title:
PLASTIC COPPER ALLOY WORKING MATERIAL, COPPER ALLOY WIRE MATERIAL, COMPONENT FOR ELECTRONIC AND ELECTRICAL EQUIPMENT, AND TERMINAL
Document Type and Number:
WIPO Patent Application WO/2022/004789
Kind Code:
A1
Abstract:
This plastic cooper alloy working material has a composition containing more than 10 ppm by mass and no more than 100 ppm by mass of Mg, with the remainder being Cu and unavoidable impurities. Among the unavoidable impurities, the S content is 10 ppm by mass or less, the P content is 10 ppm by mass or less, the Se content is 5 ppm by mass or less, the Te content is 5 ppm by mass or less, the Sb content is 5 ppm by mass or less, the Bi content is 5 ppm by mass or less, the As content is 5 ppm by mass or less, and the total content of S, P, Se, Te, Sb, Bi, and As is 30 ppm by mass or less. The mass ratio [Mg]/[S + P + Se + Te + Sb + Bi + As] is within the range of from 0.6 to 50, inclusive. Furthermore, the electrical conductivity is 97% IACS or greater, the tensile strength is 200 MPa or greater, and the heat resistance temperature is 150ºC or higher.
More Like This:
Inventors:
MATSUNAGA HIROTAKA (JP)
ITO YUKI (JP)
FUKUOKA KOSEI (JP)
MAKI KAZUNARI (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
MORI HIROYUKI (JP)
ITO YUKI (JP)
FUKUOKA KOSEI (JP)
MAKI KAZUNARI (JP)
MORIKAWA KENJI (JP)
FUNAKI SHINICHI (JP)
MORI HIROYUKI (JP)
Application Number:
PCT/JP2021/024762
Publication Date:
January 06, 2022
Filing Date:
June 30, 2021
Export Citation:
Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
C22C9/00; H01B1/02; H01B5/02; C22F1/00; C22F1/08
Domestic Patent References:
| WO2021107102A1 | 2021-06-03 |
Foreign References:
| JPS4915324B1 | 1974-04-13 | |||
| JP2017179490A | 2017-10-05 | |||
| US20060198757A1 | 2006-09-07 | |||
| JPS5789448A | 1982-06-03 | |||
| JPS5794537A | 1982-06-12 | |||
| JP2016056414A | 2016-04-21 | |||
| JP2020112927A | 2020-07-27 | |||
| JP2020112695A | 2020-07-27 | |||
| JP2021091160A | 2021-06-17 | |||
| JP2016056414A | 2016-04-21 |
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
Download PDF: