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Patent Searching and Data


Title:
PLATE HEAT EXCHANGER
Document Type and Number:
WIPO Patent Application WO/2021/020749
Kind Code:
A1
Abstract:
A plate heat exchanger, according to an embodiment of the present invention, comprises: a plate package in which a plurality of heat exchange plates are stacked to form a flow path through which fluid flows; an end plate coupled to the outside of the plate package; and a socket passing through the end plate and connected to the plate package, wherein the end plate comprises: a base in contact with the outside of the plate package; a socket hole formed to pass through the base, and into which the socket is inserted; and a raised portion protruding outward from an edge of the socket hole of the base.

Inventors:
CHOI JIWON (KR)
LEE EUNGYUL (KR)
LEE HANCHOON (KR)
Application Number:
PCT/KR2020/008642
Publication Date:
February 04, 2021
Filing Date:
July 02, 2020
Export Citation:
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Assignee:
LG ELECTRONICS INC (KR)
International Classes:
F28D9/00; F28F9/02
Foreign References:
JPH1151591A1999-02-26
EP2551626A12013-01-30
KR20100074435A2010-07-02
US6988541B22006-01-24
US7568520B22009-08-04
KR20100133402A2010-12-21
Other References:
See also references of EP 4006477A4
Attorney, Agent or Firm:
HAW, Yong Noke (KR)
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