Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
PLATE-LIKE SILICON NITRIDE-BASED SINTERED BODY AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2021/117829
Kind Code:
A1
Abstract:
The present invention provides a method for obtaining a plate-like silicon nitride-based sintered body which exhibits high thermal conductivity and excellent mechanical characteristics (strength and fracture toughness). In the present invention, a plate-like silicon nitride-based sintered body in which the oxygen content and the ratio of alkaline earth metal content and rare earth metal content are controlled highly accurately is produced by: adding a sintering aid to a silicon nitride raw material obtained by blending a first silicon nitride powder, which has a β fraction of 0-10% and has a specified oxygen content, specific surface area and average particle diameter, and a second silicon nitride powder, which has a β fraction of 60-100% and has a specified oxygen content, specific surface area, average particle diameter and aspect ratio, thereby preparing a starting material composition; producing a green sheet from the starting material composition using a sheet molding process; and then sintering by holding the green sheet in a pressurized atmosphere having a nitrogen-containing gas pressure of 0.15-3 MPa in a temperature region in which the maximum holding temperature is 1790-1910ºC. Also provided are a raw material powder mixture and a silicon nitride-based sintered body.

Inventors:
FUJINAGA TAKERU (JP)
INO AKI (JP)
HONDA MICHIO (JP)
FUJINAGA MASATAKA (JP)
SHIBATA KOJI (JP)
YAMADA TETSUO (JP)
Application Number:
PCT/JP2020/046124
Publication Date:
June 17, 2021
Filing Date:
December 10, 2020
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
UBE INDUSTRIES (JP)
International Classes:
C04B35/593; C01B21/068; C04B35/587; H05K1/03
Domestic Patent References:
WO2010002001A12010-01-07
WO2013146713A12013-10-03
WO2019235593A12019-12-12
WO2019235594A12019-12-12
Foreign References:
JP2006096661A2006-04-13
JP2018070436A2018-05-10
JP2019052072A2019-04-04
JP2001064080A2001-03-13
Attorney, Agent or Firm:
AOKI, Atsushi et al. (JP)
Download PDF:



 
Previous Patent: SOLID-STATE BATTERY

Next Patent: PACKAGE