PLATE-LIKE TEMPERATURE UNIFORMING DEVICE

WIPO Patent Application WO/2017/015814

A1

Disclosed is a plate-like temperature uniforming device (10), comprising an upper shell (11), a lower shell (21), a supporting frame (31), a capillary material (41), and an actuating fluid, wherein a plurality of ribs (32) are connected to one another to form the supporting frame (31), a plurality of enclosing spaces (34) which are regularly arranged are formed among the ribs (32), moreover, both ends of each rib (32) are respectively defined as an upper abutting end (321) and a lower abutting end (322), the upper abutting end (321) of each rib (32) is located upon the lower abutting end (322) of another rib (32), and the lower abutting end (322) of each rib (32) is located under the upper abutting end (321) of another rib (32). By means of the connecting relation between the upper abutting end (321) and lower abutting end (322) of each rib (32), the rib (32) presents an inclined state in which one end is high and the other end is low, consequently, two sub-spaces (33) are respectively formed under the part of each rib (32) close to the upper abutting end (321) and over the part of the rib close to the lower abutting end (322), and the sub-spaces (33) is spatially in communication with the enclosing spaces (34).

JPH0765230	PROBLEM TO BE SOLVED: To form a porous layer on a metal surface.
WO/2010/012798	HEAT EXCHANGE STRUCTURE AND COOLING DEVICE INCLUDING SUCH A STRUCTURE
WO/2020/110973	HEAT SINK

CHIN CHI-TE (CN)

PCT/CN2015/085146

February 02, 2017

July 27, 2015

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CHIN CHI-TE (CN)

F28D15/04

CN1672258A	2005-09-21
CN1864043A	2006-11-15
TW201331538A	2013-08-01
US20070240860A1	2007-10-18
US20100006268A1	2010-01-14
CN101014235A	2007-08-08

See also references of EP 3330654A4

LECOME INTELLECTUAL PROPERTY AGENT LTD. (CN)

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