Title:
PLATE MATERIAL AND METHOD FOR PRODUCING PLATE MATERIAL
Document Type and Number:
WIPO Patent Application WO/2018/220891
Kind Code:
A1
Abstract:
This plate material (1) comprises a clad material (10) which has a thickness of 2 mm or less and which is provided with: a first layer (11) composed of Cu, a Cu alloy, Al or an Al alloy; and a second layer (12) and a third layer (13) that are composed of stainless steel, Ti or a Ti alloy. The clad material comprises, in the side surfaces (10a, 10b) orthogonal to the lamination direction of the clad material, groove-shaped recessed portions (14, 15) in which the first layer is recessed with respect to the second layer and the third layer.
Inventors:
MIYAO YUKIMITSU (JP)
Application Number:
PCT/JP2017/046825
Publication Date:
December 06, 2018
Filing Date:
December 27, 2017
Export Citation:
Assignee:
HITACHI METALS LTD (JP)
International Classes:
B32B15/01; B23K20/04; C23F1/18; C23F1/20; C25F3/02; C25F3/04; C25F3/14
Domestic Patent References:
| WO2017057665A1 | 2017-04-06 |
Foreign References:
| JP2005028413A | 2005-02-03 | |||
| CN205149073U | 2016-04-13 | |||
| CN101103878A | 2008-01-16 | |||
| JPH08332540A | 1996-12-17 | |||
| JPH079168A | 1995-01-13 | |||
| JP2006159797A | 2006-06-22 |
Attorney, Agent or Firm:
MIYAZONO, Hirokazu (JP)
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