Title:
PLATED MATERIAL AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2018/190202
Kind Code:
A1
Abstract:
The present invention addresses the problem of low adhesion between a plating layer and a substrate due to an interface between the plating layer and the substrate. A plated material (5) includes: a substrate (51) that includes one or more substrate metallic elements; and a plating layer (52) that is formed directly on the substrate (51). The plating layer (52) includes at least a first plating layer metallic element, and a second plating layer metallic element that is different from the first plating layer metallic element. The second plating layer metallic element is the same metallic element as at least one of the one or more substrate metallic elements. In a thickness direction of the plating layer (52), the proportion of the second plating layer metallic element in the plating layer (52) continuously decreases in accordance with greater distance away from the substrate (51). Crystal grains of an alloy that includes at least the first and the second plating layer metallic elements are dispersed in the plating layer (52), such that no clear interface is produced between the substrate (51) and the plating layer (52).
Inventors:
IIMORI MASAYUKI (JP)
TAKEDA RYOSUKE (JP)
TAKEDA RYOSUKE (JP)
Application Number:
PCT/JP2018/014318
Publication Date:
October 18, 2018
Filing Date:
April 03, 2018
Export Citation:
Assignee:
YKK CORP (JP)
International Classes:
C25D7/02; C25D3/56; C25D5/10; C25D17/16
Domestic Patent References:
| WO2013141166A1 | 2013-09-26 |
Foreign References:
| JP2002042556A | 2002-02-08 | |||
| JP2012087388A | 2012-05-10 | |||
| JP2014019953A | 2014-02-03 | |||
| JPH01139799A | 1989-06-01 | |||
| JP2017015365W | 2017-04-14 | |||
| JP2017017949W | 2017-05-11 |
Other References:
See also references of EP 3611293A4
Attorney, Agent or Firm:
AXIS PATENT INTERNATIONAL (JP)
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