Title:
PLATED MATERIAL FOR TERMINALS, TERMINAL USING SAME, AND ELECTRIC WIRE WITH TERMINAL
Document Type and Number:
WIPO Patent Application WO/2023/095895
Kind Code:
A1
Abstract:
A plated material (1) for terminals is provided with: a metal base material (2) which contains copper or a copper alloy; and a plurality of silver plating layers which are arranged on the metal base material (2), while containing either silver or a silver alloy. The plurality of silver plating layers include a first silver plating layer (3) and a second silver plating layer (4) that is formed of pure silver and is directly superposed on the first silver plating layer (3); and the average grain size of crystal grains in the second silver plating layer (4) is larger than the average grain size of crystal grains in the first silver plating layer (3).
Inventors:
FUJITA HIROSHI (JP)
MIZUNO HIDEKI (JP)
YAMAUCHI YASUO (JP)
OHNISHI SATOKA (JP)
MIZUNO HIDEKI (JP)
YAMAUCHI YASUO (JP)
OHNISHI SATOKA (JP)
Application Number:
PCT/JP2022/043625
Publication Date:
June 01, 2023
Filing Date:
November 25, 2022
Export Citation:
Assignee:
YAZAKI CORP (JP)
International Classes:
C25D5/12; C25D7/00; H01B5/02; H01B7/00; H01R13/03
Domestic Patent References:
| WO2021166581A1 | 2021-08-26 | |||
| WO2022123818A1 | 2022-06-16 |
Foreign References:
| JP2015165483A | 2015-09-17 | |||
| JP2020172675A | 2020-10-22 | |||
| JP2019031732A | 2019-02-28 | |||
| JP2009079250A | 2009-04-16 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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