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Title:
PLATED MOLDED BODY OF THERMOPLASTIC RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2022/050424
Kind Code:
A1
Abstract:
Provided is a molded body that has excellent shielding properties for low frequency range electromagnetic waves of no more than 1 MHz.　The present invention provides a plated molded body that includes: a resin layer of a thermoplastic resin composition that contains a soft magnetic powder that includes an Fe-Si-Al alloy; and a coating layer of a conductive metal.

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Inventors:
MIYAMA AKIRA (JP)
MASHIKO YOSHIHIRO (JP)
Application Number:
PCT/JP2021/032860
Publication Date:
March 10, 2022
Filing Date:
September 07, 2021
Export Citation:
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Assignee:
DENKA COMPANY LTD (JP)
International Classes:
C23C18/16; B32B15/08; C08K3/10; C08L101/00; C23C18/31
Domestic Patent References:
WO2014115475A12014-07-31
Foreign References:
JP2008270793A2008-11-06
JPH0595197A1993-04-16
JP2007295558A2007-11-08
JP2012151205A2012-08-09
JP2008021990A2008-01-31
JP2015220259A2015-12-07
JP2017126644A2017-07-20
JP2018085391A2018-05-31
JPH1129663A1999-02-02
Other References:
JOURNAL OF THE JAPAN RESEARCH ASSOCIATION FOR TEXTILE END-USES (SEN-SHO-SHI, vol. 40, no. 2, 1999
See also references of EP 4212646A4
Attorney, Agent or Firm:
SK INTELLECTUAL PROPERTY LAW FIRM et al. (JP)
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