PLATING APPARATUS AND PLATING METHOD

Title:

PLATING APPARATUS AND PLATING METHOD

Document Type and Number:

WIPO Patent Application WO/2016/143714

Kind Code:

A1

Abstract:

The present invention addresses the problem of providing a plating apparatus and a plating method which allow suitable electrolytic plating to be applied even when an object to be plated has high electrical resistance. This problem can be solved by a roll plating apparatus for electrolytically plating an elongate sheet 7. The roll plating apparatus is configured so that a cathode roll among one or more aerial rolls 3 supplies power to the elongate sheet 7 while the elongate sheet 7 is transferred by the aerial rolls 3 in a plating solution with an anode 6 therein, and so that the aerial cathode roll supplies power to the non-plated elongate sheet 7 submerged in the plating solution in the opposite direction to the direction of transfer of the elongate sheet 7 in order to electrolytically plate the elongate sheet 7.

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Inventors:

OHYA HIDENOBU (JP)
YAMAUCHI MASAYOSHI (JP)
NIIZUMA NAOTO (JP)
OMATA TAKENORI (JP)

Application Number:

PCT/JP2016/056885

Publication Date:

September 15, 2016

Filing Date:

March 04, 2016

Export Citation:

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Assignee:

KONICA MINOLTA INC (JP)

International Classes:

C25D7/06; C25D5/02; C25D5/56; C25D21/00

Foreign References:

JP2013131686A	2013-07-04
JP2007162118A	2007-06-28
JPH07310197A	1995-11-28

Attorney, Agent or Firm:

MARUYAMA EIICHI (JP)
Maruyama Eiichi (JP)

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