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Title:
PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2005/123989
Kind Code:
A1
Abstract:
A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section. The plating liquid flows spirally from the lower end of the gap to the upper end by action of a vortex producing flow path (29) communicating to the lower end of the gap. The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.

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Inventors:
OGAWA YOSHIMITSU (JP)
MIYASAKA HAJIME (JP)
Application Number:
PCT/JP2005/008847
Publication Date:
December 29, 2005
Filing Date:
May 10, 2005
Export Citation:
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Assignee:
HONDA MOTOR CO LTD (JP)
OGAWA YOSHIMITSU (JP)
MIYASAKA HAJIME (JP)
International Classes:
C25D5/08; C25D7/00; C25D7/04; C25D17/00; C25D17/12; C25D21/10; C25D21/14; F02F1/00; (IPC1-7): C25D7/00; C25D5/08; C25D7/04; C25D17/00; C25D17/12; C25D21/10; F02F1/00
Foreign References:
JPS63206496A1988-08-25
JPH09310196A1997-12-02
JPS298160B1
JPH07157897A1995-06-20
JPH07157898A1995-06-20
JP2000192285A2000-07-11
Attorney, Agent or Firm:
Shimoda, Yo-ichiro (1-12, Akasaka 1-chome, Minato-ku Tokyo, JP)
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