PLATING APPARATUS

WIPO Patent Application WO/2023/203720

A1

The present invention provides a technology that makes it possible to prevent the deterioration in plating quality of a substrate due to the formation of air bubbles coming from an anode.　A plating module 400 includes: a plating tank 10 that is so configured as to accommodate a plating solution therein; an anode 13 that is placed in the plating tank 10; a substrate holder 20 that is so configured as to hold a substrate Wf of which a surface to be plated is directed downward so as to face the anode 13; a membrane module 40 that has a first membrane 41 partitioning the inside of the plating tank 10 into an anode chamber 11 and a cathode chamber 12 and a second membrane 42 arranged between the first membrane 41 and the anode 13; and a tube member 31 that communicates a first region R1 positioned below the anode 13 in the plating tank 10 with a second region R2 positioned between the first membrane 41 and the second membrane 42.

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OMATA SHINJI (JP)
TOMITA MASAKI (JP)
YAMAMOTO KENTARO (JP)
MASUDA YASUYUKI (JP)

PCT/JP2022/018410

October 26, 2023

April 21, 2022

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EBARA CORP (JP)

C25D17/00; C25D7/12

JP7057869B1	2022-04-20
US6964792B1	2005-11-15
JP2002275693A	2002-09-25
JP2002146599A	2002-05-22

MIYAMAE, Toru et al. (JP)

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