Title:
PLATING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2024/070236
Kind Code:
A1
Abstract:
Provided is a plating apparatus with which, even when the flow amount of a plating solution sprayed from a spray unit is increased, there is no excessive rising of a material subject to plating to a high position within retained plating solution, and defects in the material subject to plating are inhibited from occurring. This plating apparatus comprises a plating bath that retains a plating solution containing a material subject to plating, and a spray unit that is formed on the plating bath and that sprays the plating solution, the material subject to plating contained in the plating solution being stirred by the plating solution sprayed from the spray unit. The spray unit has an inner cylindrical shape having a bottom surface that expands in the horizontal direction, an inner wall that extends in the height direction from the bottom surface, and an opening formed at the upper end of the inner wall. The opening is a first spray port through which the plating solution is sprayed into the plating bath. A mesh member is provided to the first spray port. A second spray port through which the plating solution is sprayed into the spray unit is provided to the bottom surface. A flow rate control plate in which a plurality of holes are formed is provided, parallel to the bottom surface, at a location partway along the height direction of the spray unit. When viewed in a planar direction, the flow rate control plate has a center part and a periphery part provided to the outer side of the center part. The respective opening areas of the holes formed in the center part is less than the respective opening areas of the holes formed in the periphery part. A cylindrical member having a hollow part is provided between the flow rate control plate and the mesh member of the first spray port.
Inventors:
SHIMADA TOMOKAZU (JP)
Application Number:
PCT/JP2023/028661
Publication Date:
April 04, 2024
Filing Date:
August 05, 2023
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
C25D17/28; C25D21/10
Domestic Patent References:
| WO2017217216A1 | 2017-12-21 |
Attorney, Agent or Firm:
KAWAMOTO, Takashi (JP)
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