PLATING DEVICE AND PLATING METHOD

Title:

PLATING DEVICE AND PLATING METHOD

Document Type and Number:

WIPO Patent Application WO/2023/145049

Kind Code:

A1

Abstract:

The present invention enables specific parts of a substrate to be shielded at a desired timing and improves uniformity in plating film thickness.　In this invention, a plating module includes: a plating bath 410 for accommodating a plating solution; an anode 430 disposed inside the plating bath 410; a substrate holder 440 for holding a substrate Wf with a surface Wf-a to be plated facing downward; a rotating mechanism 447 configured to cause the substrate holder 440 to rotate in a first direction and in a second direction which is opposite to the first direction; and a shielding mechanism 485 for causing a shielding member 481 to move to a position between the anode 430 and the substrate Wf in accordance with a rotation angle of the substrate holder 440.

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Inventors:

SHIMOYAMA MASASHI (JP)
MASUDA YASUYUKI (JP)
HIWATASHI RYOSUKE (JP)

Application Number:

PCT/JP2022/003526

Publication Date:

August 03, 2023

Filing Date:

January 31, 2022

Export Citation:

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Assignee:

EBARA CORP (JP)

International Classes:

C25D7/12; C25D17/10

Foreign References:

JP6993537B1	2022-01-13
JP6901646B1	2021-07-14
US6402923B1	2002-06-11
US20160362809A1	2016-12-15

Attorney, Agent or Firm:

MIYAMAE, Toru et al. (JP)

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