Title:
PLATING DEVICE AND PLATING METHOD
Document Type and Number:
WIPO Patent Application WO/2023/188371
Kind Code:
A1
Abstract:
According to the present invention, a plating device comprises a plating tank for holding a plating liquid, an anode that is arranged inside the plating tank and has a plurality of through holes, a substrate holder that holds a substrate opposite the anode, a diaphragm that is arranged against a first surface of the anode that is on the substrate side, and a back surface plate that is arranged opposite a second surface of the anode that is on the reverse side from the first surface at a prescribed gap from the second surface and regulates the amount of bubbles that arise from the anode and accumulate on the second surface.
Inventors:
TAKAHASHI NAOTO (JP)
Application Number:
PCT/JP2022/016809
Publication Date:
October 05, 2023
Filing Date:
March 31, 2022
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D17/00
Foreign References:
| JP2020200502A | 2020-12-17 | |||
| JP2021110017A | 2021-08-02 | |||
| JPH04210492A | 1992-07-31 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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