Title:
PLATING DEVICE AND STIRRING METHOD FOR PLATING SOLUTION
Document Type and Number:
WIPO Patent Application WO/2022/137277
Kind Code:
A1
Abstract:
Provided is a technology for causing a plating solution to be stirred without using a paddle. This plating device 1000 comprises a holder cover 50 that is disposed on a substrate holder 30 and rotates with the substrate holder when the substrate holder rotates. The holder cover has a lower surface that is immersed in the plating solution and is positioned lower than a surface to be plated of a substrate. At least one cover groove extending in a direction crossing the rotation direction of the holder cover is provided to the lower surface of the holder cover.
Inventors:
CHANG SHAO HUA (JP)
SEKI MASAYA (JP)
SEKI MASAYA (JP)
Application Number:
PCT/JP2020/047645
Publication Date:
June 30, 2022
Filing Date:
December 21, 2020
Export Citation:
Assignee:
EBARA CORP (JP)
International Classes:
C25D7/12; C25D17/06; C25D21/10
Domestic Patent References:
| WO2013157129A1 | 2013-10-24 |
Foreign References:
| JPH02205696A | 1990-08-15 | |||
| JP2001064795A | 2001-03-13 | |||
| US20040182715A1 | 2004-09-23 |
Attorney, Agent or Firm:
MIYAMAE, Toru et al. (JP)
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